Integrated Package On Package
Trademark details
Integrated Package On Package® is a registered trademark used for Semiconductor Package Modules Comprised of Semiconductor Dies and Interconnects Custom Fabrication, Namely, the Assembly and Encapsulation of Semiconductor Devices For Others Design of Packaging For Semiconductor Devices For Others, and Testing of Semiconductor Devices and owned by Amkor Technology, Inc.. Full trade mark registration details, registered images and more information below.
| Goods and/or Services: | Semiconductor Package Modules Comprised of Semiconductor Dies and Interconnects Custom Fabrication, Namely, the Assembly and Encapsulation of Semiconductor Devices For Others Design of Packaging For Semiconductor Devices For Others, and Testing of Semiconductor Devices |
| Serial Number: | 77092585 |
| Filing Date: | Jan 26, 2007 |
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Last Applicant(s)/ Owner(s) of Record | Amkor Technology, Inc.1900 South Price Rd. |
| Related Products: | Electrical and Scientific Apparatus, Material Treatment, Miscellaneous Services; Scientific and technological services, and research and design relating thereto; Industrial analysis and research services; Design and development of computer hardware and software; Legal services |
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Amkor Technology, Inc in Morrisville, North Carolina, USA
Edit this Company edit this company Amkor Technology, Inc 140 Suthcenter Ct Ste 600 Morrisville...http://www.amkor.com Description Amkor Technology, Inc. is a publicly traded company providing contract...
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