Amkor Technology, Inc
3945 Freedom Cir Ste 830
Santa Clara, California 95054-1226
USA
tel: +1 4084960303
http://www.amkor.com
Description
Amkor Technology, Inc. is a publicly traded company providing contract semiconductor assembly and test services. Assembly and testing are two of the three steps required to produce a finished integrated circuit ready for use in a host of electronic applications. After transistors and electronic circuitry are deposited onto a silicon wafer, the wafer is assembled, or "packaged," by being cut into separate integrated circuits, which are connected electrically to a system board through a protective housing. The packaged integrated circuit is then subjected to testing to verify function, current, timing, and voltage. In addition, Amkor offers value-added services such as electrical package characterization and thermal package characterization, which help designers to learn how a device will perform in a finished package. The company also can help in the design of a package and provide other services, including die processing, package signal integrity analysis, failure analysis, and qualification testing. Amkor serves major global customers such as Agilent, Intel, Philips, Sony, and Toshiba. Amkor maintains its corporate headquarters in West Chester, Pennsylvania, where its founder and chairman, James J. Kim, lives, but most of the company's U.S. operations are located in Arizona, and manufacturing is conducted overseas in seven Asia-Pacific countries.
Products
- Communications consulting
- Electronic parts and equipment, nec
- Instrument Manufacturing for Measuring and Testing Electricity and Electrical Signals
- Other Electronic Parts and Equipment Merchant Wholesalers
- Other Scientific and Technical Consulting Services
- Semiconductor and Related Device Manufacturing
- Semiconductor devices
- Semiconductor test equipment
- Semiconductors and related devices
Locations
- 1900 S Price Rd
Chandler, Arizona 85286-6604
USA
tel: +1 4808215000 - 3 Corporate Park Ste 230
Irvine, California 92606-5163
USA
tel: +1 9497241881
- 105 Central St
Stoneham, Massachusetts 02180-1253
USA
tel: +1 7814387800 - 7800 Airport Center Dr # 401
Greensboro, North Carolina 27409-9091
USA
tel: +1 3364782314 - 140 Suthcenter Ct Ste 600
Morrisville, North Carolina 27560
USA
tel: +1 9194591239 - 3021 Cornwallis Rd
Research Triangle Pa, North Carolina 27709
USA
tel: +1 9199410606 - 611 S Congress Ave # 450
Austin, Texas 78704-8706
USA
tel: +1 5122368150 - 6363 N State Highway 161 # 300
Irving, Texas 75038-2269
USA
tel: +1 9725801879
News and Blogs
Total : 3 View more »
I-Micronews - ADVANCED PACKAGING : Panel: Let s rally around 3D chip standards...
...Interposers are very large,” said Ruben Fuentes, senior director in the Technology and Platform Development group at Amkor Technology Inc., during the panel. “They are very complex.” Not all is lost and there are solutions to the...
I-Micronews - ADVANCED PACKAGING: 3D IC, WLP & TSV : Amkor licenses through mold via technology to
...WLP & TSV Apr 2nd, 2012 Amkor licenses through mold via technology to Shinko for PoP and 3DIC products Amkor Technology, Inc. a leading provider of semiconductor packaging and test services, today announced that it has granted SHINKO...
I-Micronews - ADVANCED PACKAGING: 3D IC, WLP & TSV : Amkor s flip chip molded BGA selected by
...3D IC, WLP & TSV Mar 21st, 2012 Amkor s flip chip molded BGA selected by Altera for its 28nm FPGAs Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, today announced that Altera Corporation...
